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Spherical Quartz Powder
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Ultra-fine milling is used to produce spherical quartz dust, which is quartz stone. You can instantly change its phase, crystal form, and structure from solid state to molten then back to solid. Amorphous powder is composed of irregularly formed angular pieces that have been transformed into regular, spherical forms.
Below are the top features
Spherical Quartz Powder
Spherical Quartz powder boasts smooth surfaces, high specific areas and excellent chemical stability. You can mix spherical Powder with resin to create a thin film. Higher amounts of quartz powder are better for electronic parts. The thermal conductivity will be lower. It also has a smaller thermal extension factor. The stress in spherical powder is 60 percent less than in angular powder. Additionally, molding compounds made from spherical crystal powder have the lowest stress concentrations and the strongest strength. Spherical quartz powder’s surface texture is extremely smooth. It is possible to extend the life expectancy of the mold’s service by up to one third due to its low friction coefficient and reduced wear.
| Spherical quartz powder Spherical SiO2 Property | |
| Other Titles | Fused quartz, spherial quartz, spherical SiO2, silica |
| 7631-86-9 | |
| Combination Formula | SiO2 |
| Motility | 60.09 |
| Appearance | Powder White |
| Melting Point | 1,600deg C (2,912deg F) |
| Solubility Into Water | N/A |
| Density | 2533 kg/m3 |
| Purity | 99.5-99.9% |
| 10-30nm | |
| Boling Point | 2,230deg C (4,046deg F) |
| Particular Heat | N/A |
| Thermal Conductivity | N/A |
| Thermal Expansion | N/A |
| Young’s Modular | N/A |
| Exact | 59.9668 g/mol |
| Monoisotopic | 59.967D |
The uses of Spherical Quartz powder
Many uses exist for spherical, powdered quartz. The most well-known is electronic packaging. Electronic packaging supports integrated circuits. As electronic circuits are becoming more complex, so do the requirements for packaging materials. To meet this demand, packaging materials are continuously optimized to be more efficient. The main three types of electronic packaging are substrate, plastic glue and frame. One of the advantages to plastic packaging is its low cost, ease-of use, and ability in large numbers. Plastic packaging accounts for 95% worldwide integrated circuits. %above. EMC is the primary plastic encapsulant. It contains over 95% microelectronics.
1. Good sealing qualities are required for microelectronic packaging. They must be resistant to high humidity and pressure. This is why epoxy molding materials must have inorganic fillers. The majority of inorganic materials are either quartz micropowder (or silicon micropowder). For large-scale ultra-large scale microelectronics circuits, there are more strict requirements regarding packaging material. EMC powder, which serves as support material for the circuit, demands that quartz powder have the correct particle size. The purity of quartz powder is important too.
2. The sphere is made of silicon micropowder and has a great form that can be used for high-end integration systems. The temperature expansion coefficient, dielectric constant and stresses of sealants can be reduced by using this product. They are extremely resistant to weather, impact and compression. In addition to its primary use in electronic packaging the spherical Quartz Powder can also be used extensively in making electronic inks.
The main supplier
Spherical Quartz Powder
Advanced material Tech Co., Ltd.
oxide powder
We have over 12 years experience developing and researching chemicals products. Credit Card, T/T and West Union are all options. Trunnano sends goods to international customers via FedEx, DHL or airmail.
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