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Spherical Quartz Powder
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Quartz spheres are made of quartz stone. Purification, ultrafine grind, and calcination transform the quartz sphere from a solid into a liquid. Amorphous powder is composed irregularly formed angular particles which have been transformed into regular-spherical.
These are key characteristics
Spherical Quartz Powder
Spherical quartz powder has smooth surfaces and high specific areas. It also exhibits excellent chemical stability. Mixing spherical Powder and resin can create a thin layer. For electronic components, higher amounts of quartz powder will be more effective. You will see a decrease in thermal conductivity. Also, it has a lower thermal expansion factor. The stress of spherical powder is 60% lower than that of angular. Spherical quartz powder mold compounds have the highest strength and stress concentration. Spherical quartz powder features a smooth, even surface. Due to the low friction coefficient of this powder and the reduced wear it has, you can extend the service life of your mold by about one-third.
Spherical Quartz Powder Spherical SiO2 Property | |
Other Titles | Fused quartz, spherial quartz, spherical SiO2, silica |
7631-86-9 | |
Combination Formula | SiO2 |
Motility | 60.09 |
Appearance | Powder White |
Melting Point | 1,600deg C (2,912deg F) |
Solubility into Water | N/A |
Density | 2533 kg/m3 |
Purity | 99.5-99.9% |
10-30nm | |
Boling Point | 2,230deg C (4,046deg F) |
Particular Heating | N/A |
Aspects Of Thermo Conductivity | N/A |
Thermal Expansion | N/A |
Young’s Modular | N/A |
Exact | 59.9668 g/mol |
Monoisotopic | 59.967D |
What uses Spherical Quartz powder can be used for
Powdered and spherical quartz can be used for many purposes. Electronic packaging is perhaps the most famous. Electronic packaging is compatible with integrated circuits. The requirements for packaging materials increase as electronic circuits get more complex. This demand is met by continuous optimization of packaging materials to increase their efficiency. Electronic packaging can be divided into three categories: frame, glue, plastic, and frame. The advantages of plastic packaging include its affordability, simplicity-of-use and high production. Plastic packaging makes up 95% of the world’s integrated circuits. %above. EMC is the principal plastic encapsulant. More than 95% contain microelectronics.
1. The microelectronic package must tolerate extreme pressures, high humidity and stress. A good sealing property is also required. These epoxy molding materials should contain inorganic fillers. Quartz micropowder and silicon micropowder are the most popular inorganic materials. Larger and more complex microelectronics systems require greater packaging requirements. EMC powder, which is used to support EMC technology, requires quartz powder to be of correct size. Quartz powder must be 100% pure.
2. It is made out of silicon micropowder. The sphere has a unique shape that can be used to integrate high-end systems. This product will reduce temperature expansion coefficients, dielectric constants and stress of sealants. This product is extremely resilient to temperature, impact, and compression. Apart from being used widely for electronic packaging the spherical Quartz powder can also be extensively used in the manufacturing and application high-end cosmetics. You can use this powder to make paint coatings.
Principal supplier
Spherical Quartz Powder
Advanced material Tech Co., Ltd.
oxide powder
Over 12 years’ experience have been gained in the development and research of chemicals. There are many options: Credit Card; T/T, West Union and West Union. Trunnano delivers goods via FedEx and DHL to customers around the world.
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